2 in 1 Head Touch Screen BGA Rework Station

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  • Last update:

    2018-08-12 03:32

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Company Profile

Shenzhen Dinghua Innovation Automation Co.,Ltd

By certification [File Integrity]

Contact: dinghua(Mr.)  




Area: Beijing

Address: Beijing

Website: http://www.dinghuatech.com/ http://dinghua.xi3y.com/

Product details

2 in 1 head Touch Screen BGA Rework Station

1. Product description of 2 in 1 head bga rework station DH-A1L

Dinghua BGA Rework Station  DH-A1L

This machine is for repairing motherboard IC/Chip/Chipset of Laptop, Mobile, PC, iPhone, Xbox, etc. With features 3-heater(2xHot air+IR Preheating), embedded Smart PC, Auto Profile, Cooling Fan, Laser  Position , Soldering  Iron, Vacuum Pick-up & Place, Universal Support for most of the PCB Size/Shape.

2. Product specification of 2 in 1 head bga rework station DH-A1L


DH-A1L  Specification

Product name

soldering and desoldering machine



Top heater

Hot air 800W

Bottom heater

Hot air 1200W, Infrared 2800W

Iron heater


Power supply

AC220V±10% 50/60Hz




V-groove, PCB support can be adjusted in any direction   with external universal fixture

Temperature control

K type thermocouple, closed loop control, independent   heating

Temp accuracy

±2 degrees

PCB size

Max 500*400 mm Min 22*22 mm

BGA chip


Minimum chip spacing


External Temperature Sensor


Net weight



3. Product advantages of  2 in 1 head bga rework station DH-A1L


4. Product details of 2 in 1 head bga rework station DH-A1L



5. Why Choose 2 in 1 head bga rework station DH-A1L

①Precise PID smart temp control , the No.1 key factor for the quality of BGA Rework Station Temperature curve.

②Accurate rework only heats the chips where is needed. All excess heat will reflow back to ensure the components around BGA will not be influenced .

③Heating doesn't influence the appearance of PCB even after using several times.

6. Packing, delivery  of 2 in 1 head bga rework station DH-A1L


7. Contact us for more details of BGA Rework Station  


8. Know something about BGA 

Light BGA package material

Optical BGA packaged shells are often made of ceramic materials. This rugged ceramic material has many advantages, such as design flexibility with micro design rules, simple process technology, high performance and high reliability, generally by changing the physics of the shell The structure can be designed for optical BGA packages.


Ceramic materials also have airtightness and good primary reliability. This is due to the fact that the thermal diffusion coefficient of the ceramic material is very similar to the thermal diffusion coefficient of the GaAs device material. Moreover, since the ceramic material can be three-dimensionally wired with overlapping channels, the overall package size will be reduced.


In general, heat can be controlled when mounting optical devices because heat can deform the package. Final alignment of the optical device with the optical fiber can also produce movement that will change the optical characteristics. With ceramic materials, thermal deformation is small. Therefore, ceramic materials are very suitable for optoelectronic component packaging and have a significant impact on the optical communications transmission network market.